iplu250n04s4-1r7 optimos ? -t2 power-transistor features ? n-channel - enhancement mode ? aec qualified ? msl1 up to 260c peak reflow ? 175c operating temperature ? green product (rohs compliant); 100% lead free ? ultra low rds(on) ? 100% avalanche tested maximum ratings, at t j =25 c, unless otherwise specified parameter symbol conditions unit continuous drain current i d t c =25c, v gs =10v 1) 250 a t c =100c, v gs =10v 2) 180 pulsed drain current 2) i d,pulse t c =25?c 1000 avalanche energy, single pulse 2) e as i d =125?a 170 mj avalanche current, single pulse i as - 250 a gate source voltage v gs - 20 v power dissipation p tot t c =25?c 188 w operating and storage temperature t j , t stg - -55 ... +175 c value v ds 40 v r ds(on) 1.7 m w i d 250 a product summary type package marking iplu250n04s4-1r7 h-psof-8-1 4n041r7 h-psof-8-1 8 1 1 8 tab tab rev. 1.0 page 1 2014-12-08
iplu250n04s4-1r7 parameter symbol conditions unit min. typ. max. thermal characteristics 2) thermal resistance, junction - case r thjc - - - 0.8 k/w smd version, device on pcb r thja minimal footprint - - 62 6 cm 2 cooling area 3) - - 40 electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs =0?v, i d =1?ma 40 - - v gate threshold voltage v gs(th) v ds = v gs , i d =80?a 2.0 3.0 4.0 zero gate voltage drain current i dss v ds =40?v, v gs =0?v, t j =25?c - 0.1 10 a v ds =18?v, v gs =0?v, t j =85?c 2) - 1 20 gate-source leakage current i gss v gs =20?v, v ds =0?v - - 100 na drain-source on-state resistance r ds(on) v gs =10?v, i d =100?a - 1 . 2 1 . 7 m values rev. 1.0 page 2 2014-12-08
iplu250n04s4-1r7 parameter symbol conditions unit min. typ. max. dynamic characteristics 2) input capacitance c iss - 6060 7900 pf output capacitance c oss - 1380 1800 reverse transfer capacitance c rss - 45 105 turn-on delay time t d(on) - 18 - ns rise time t r - 18 - turn-off delay time t d(off) - 18 - fall time t f - 25 - gate charge characteristics 2) gate to source charge q gs - 34 45 nc gate to drain charge q gd - 11 25 gate charge total q g - 76 100 gate plateau voltage v plateau - 5.7 - v reverse diode diode continous forward current 2) i s - - 250 a diode pulse current 2) i s,pulse - - 1000 diode forward voltage v sd v gs =0?v, i f =100?a, t j =25?c - 0.9 1.3 v reverse recovery time 2) t rr - 55 - ns reverse recovery charge 2) q rr - 60 - nc values v gs =0?v, v ds =25?v, f =1?mhz v dd =20?v, v gs =10?v, i d =250?a, r g =3.5? w v dd =32?v, i d =250?a, v gs =0?to?10?v 2) defined by design. not subject to production test. 3) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. 1) current is limited by bondwire; with an r thjc = 0.8 k/w the chip is able to carry 254a at 25c. v r =20?v, i f =50a, d i f /d t =100?a/s t c =25?c rev. 1.0 page 3 2014-12-08
iplu250n04s4-1r7 1 power dissipation 2 drain current p tot = f( t c ); v gs = 10 v i d = f( t c ); v gs = 10 v 3 safe operating area 4 max. transient thermal impedance i d = f( v ds ); t c = 25 c; d = 0 z thjc = f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 1 10 100 1000 10000 0.1 1 10 100 i d [ a ] v ds [v] single pulse 0.01 0.05 0.1 0.5 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 -3 10 -2 10 -1 10 0 z t h j c [ k / w ] t p [s] 0 50 100 150 200 0 50 100 150 200 p t o t [ w ] t c [ c] 0 50 100 150 200 250 300 0 50 100 150 200 i d [ a ] t c [ c] rev. 1.0 page 4 2014-12-08
iplu250n04s4-1r7 5 typ. output characteristics 6 typ. drain-source on-state resistance i d = f( v ds ); t j = 25 c r ds(on) = ( i d ); t j = 25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. drain-source on-state resistance i d = f( v gs ); v ds = 6v r ds(on) = f( t j ); i d = 100 a; v gs = 10 v parameter: t j 0.8 1 1.2 1.4 1.6 1.8 2 2.2 -60 -20 20 60 100 140 180 r d s ( o n ) [ m w ] t j [ c] -55 c 25 c 175 c 0 200 400 600 800 1000 2 4 6 8 i d [ a ] v gs [v] 5 v 6 v 6.5 v 7 v 10 v 0 200 400 600 800 1000 0 1 2 3 4 i d [ a ] v ds [v] 5 v 6 v 6.5 v 7 v 10 v 0 2 4 6 8 10 0 250 500 750 1000 r d s ( o n ) [ m w ] i d [a] rev. 1.0 page 5 2014-12-08
iplu250n04s4-1r7 9 typ. gate threshold voltage 10 typ. capacitances v gs(th) = f( t j ); v gs = v ds c = f( v ds ); v gs = 0 v; f = 1 mhz parameter: i d 11 typical forward diode characteristicis 12 avalanche characteristics if = f(v sd ) i as = f( t av ) parameter: t j parameter: t j(start) 25 c 100 c 150 c 1 10 100 1000 1 10 100 1000 i a v [ a ] t av [s] 25 c 175 c 10 0 10 1 10 2 10 3 10 4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 i f [ a ] v sd [v] 80 a 800 a 1 1.5 2 2.5 3 3.5 4 -60 -20 20 60 100 140 180 v g s ( t h ) [ v ] t j [ c] 10 1 10 2 10 3 10 4 0 5 10 15 20 25 30 c [ p f ] v ds [v] rev. 1.0 page 6 2014-12-08
iplu250n04s4-1r7 13 avalanche energy 14 drain-source breakdown voltage e as = f( t j ) v br(dss) = f( t j ); i d_typ = 1 ma parameter: i d 15 typ. gate charge 16 gate charge waveforms v gs = f( q gate ); i d = 250 a pulsed parameter: v dd 38 39 40 41 42 43 44 -60 -20 20 60 100 140 180 v b r ( d s s ) [ v ] t j [ c] 8 v 32 v 0 2 4 6 8 10 12 0 20 40 60 80 v g s [ v ] q gate [nc] 250 a 125 a 62.5 a 0 100 200 300 400 25 75 125 175 e a s [ m j ] t j [ c] v gs q gate q gs q gd q g v gs q gate q gs q gd q g rev. 1.0 page 7 2014-12-08
iplu250n04s4-1r7 published by infineon technologies ag 81726 munich, germany ? infineon technologies ag 2014 all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev. 1.0 page 8 2014-12-08
iplu250n04s4-1r7 revision history version revision 1.0 08.12.2014 final data sheet date changes rev. 1.0 page 9 2014-12-08
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